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<span style='color:red'>Microsoft</span> Unveils In-House AI Chip, Poised for Competitive Edge with a Powerful Ecosystem

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Microsoft Unveils In-House AI Chip, Poised for Competitive Edge with a Powerful Ecosystem

　　Printed Circuit Boards (PCBs) are the fundamental building blocks of modern electronics, comprising a myriad of components meticulously arranged to enable the functionality of electronic devices. Identifying these components on a PCB and understanding their roles is essential for troubleshooting, repairs, and even designing electronic circuits.　　In this comprehensive guide, we delve into the world of PCB components, unraveling their types, functionalities, and methods of identification.　　Understanding PCB Components1. Resistors:　　• Identification: Resistors are usually small, cylindrical components with colored bands indicating resistance values. Use a multimeter to measure resistance if the bands are unclear.　　• Function: Resistors limit current flow in a circuit, adjusting voltage levels or protecting components.　　2. Capacitors:　　• Identification: Capacitors come in various shapes (cylindrical, rectangular) and sizes, often labeled with capacitance values and voltage ratings.　　• Function: They store and release electrical energy, filtering signals or stabilizing voltage.　　3. Diodes:　　• Identification: Diodes appear as small cylindrical or square-shaped components with a stripe indicating polarity.　　• Function: They allow current flow in one direction, blocking it in the opposite direction.　　4. Transistors:　　• Identification: Transistors come in different shapes (often three-legged), with part numbers indicating their type.　　• Function: They amplify or switch electronic signals, serving as the basic building blocks of electronic devices.　　5. Integrated Circuits (ICs):　　• Identification: ICs are rectangular components with multiple pins. The part number often includes information about the manufacturer and type.　　• Function: ICs integrate various functions (logic, memory, amplification) into a single package.　　6. Inductors:　　• Identification: Inductors resemble wire coils and are labeled with inductance values.　　• Function: They store energy in a magnetic field and resist changes in current flow.　　7. Connectors and Headers:　　• Identification: Connectors are ports or slots for external connections. Headers are sets of pins for internal connections.　　• Function: They facilitate the connection of external components or other PCBs.　　Techniques for Identifying PCB componentsVisual Inspection:　　Markings and Labels: Many components have printed markings indicating their values, part numbers, or manufacturers.　　Physical Characteristics: Size, shape, and color often provide clues about a component’s type and function.　　Multimeter and Testing:　　Resistance Measurement: Use a multimeter in resistance mode to identify resistors and check for their values.　　Capacitance Measurement: Multimeters with capacitance measuring capabilities can identify capacitors.　　Datasheets and Component Manuals:　　Online Resources: Manufacturers provide datasheets detailing component specifications and identification information.　　Component Manuals: Some components have manuals with comprehensive details for identification.　　Challenges and Conclusion　　Identifying PCB components can present challenges due to the sheer diversity of shapes, sizes, and labeling conventions across manufacturers. Furthermore, miniaturization and surface-mount technology have made identification more intricate.　　In conclusion, mastering the identification of PCB components is a foundational skill for electronics enthusiasts, engineers, and technicians. Utilizing a combination of visual inspection, testing tools, datasheets, and experience will empower individuals to decipher the complexities of PCBs, enabling effective troubleshooting, circuit design, and maintenance within the dynamic landscape of electronics.

Key word：

Chip

Release time：2023-11-23 13:19 reading：1620 Continue reading>>

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Microsoft First In-House AI Chip “Maia” Produced by TSMC’s 5nm

　　On the 15th, Microsoft introducing its first in-house AI chip, “Maia.” This move signifies the entry of the world’s second-largest cloud service provider (CSP) into the domain of self-developed AI chips. Concurrently, Microsoft introduced the cloud computing processor “Cobalt,” set to be deployed alongside Maia in selected Microsoft data centers early next year. Both cutting-edge chips are produced using TSMC’s advanced 5nm process, as reported by UDN News.　　Amidst the global AI fervor, the trend of CSPs developing their own AI chips has gained momentum. Key players like Amazon, Google, and Meta have already ventured into this territory. Microsoft, positioned as the second-largest CSP globally, joined the league on the 15th, unveiling its inaugural self-developed AI chip, Maia, at the annual Ignite developer conference.　　These AI chips developed by CSPs are not intended for external sale; rather, they are exclusively reserved for in-house use. However, given the commanding presence of the top four CSPs in the global market, a significant business opportunity unfolds. Market analysts anticipate that, with the exception of Google—aligned with Samsung for chip production—other major CSPs will likely turn to TSMC for the production of their AI self-developed chips.　　TSMC maintains its consistent policy of not commenting on specific customer products and order details.　　TSMC’s recent earnings call disclosed that 5nm process shipments constituted 37% of Q3 shipments this year, making the most substantial contribution. Having first 5nm plant mass production in 2020, TSMC has introduced various technologies such as N4, N4P, N4X, and N5A in recent years, continually reinforcing its 5nm family capabilities.　　Maia is tailored for processing extensive language models. According to Microsoft, it initially serves the company’s services such as $30 per month AI assistant, “Copilot,” which offers Azure cloud customers a customizable alternative to Nvidia chips.　　Borkar, Corporate VP, Azure Hardware Systems & Infrastructure at Microsoft, revealed that Microsoft has been testing the Maia chip in Bing search engine and Office AI products. Notably, Microsoft has been relying on Nvidia chips for training GPT models in collaboration with OpenAI, and Maia is currently undergoing testing.　　Gulia, Executive VP of Microsoft Cloud and AI Group, emphasized that starting next year, Microsoft customers using Bing, Microsoft 365, and Azure OpenAI services will witness the performance capabilities of Maia.　　While actively advancing its in-house AI chip development, Microsoft underscores its commitment to offering cloud services to Azure customers utilizing the latest flagship chips from Nvidia and AMD, sustaining existing collaborations.　　Regarding the cloud computing processor Cobalt, adopting the Arm architecture with 128 core chip, it boasts capabilities comparable to Intel and AMD. Developed with chip designs from devices like smartphones for enhanced energy efficiency, Cobalt aims to challenge major cloud competitors, including Amazon.

Key word：

Microsoft

Release time：2023-11-17 16:00 reading：1517 Continue reading>>

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Microsoft Teams Up with Taiwan’s AI LAB to Jointly Announce AI Gene Analysis Platform

Taiwan Microsoft and Taiwan’s Artificial Intelligence Laboratory (AI LAB) have jointly announced the TaiGenomics Artificial Intelligence gene analysis platform. Integrated with Microsoft’s Azure Cloud Computing, the platform conducts gene sequencing, analysis, and diagnosis effectively through the use of AI to assist medical specialists in the rapid prediction of potential diseases caused by genetic variations.Taiwan AI LAB Founder Ethan Tu stated that Taiwan has an advantage in the development of precision medical care, and in addition to having a solid foundation in the communications industry, Taiwan’s National Health Insurance Database, medical records, and medical electronic imaging also provide robust databases for genetic testing.This collaboration with Microsoft utilizes the advantages of Azure to develop TaiGenomics, which analyzes the necessary space and cloud computing resources necessary for the analysis of medical big data. It is anticipated that this collaboration will enable TaiGenomics to develop Taiwan’s strengths and drive a new ecology through integration with the medical treatment ecosystem. Furthermore, there is an opportunity to begin this endeavor in Taiwan and then extend it to the rest of the world.General Manager of Microsoft Taiwan Sun Jikang stated: AI has always been Microsoft’s goal, and we anticipate that the joint development of the TaiGenomics gene analysis platform with Taiwan’s AI LAB will serve as a connection with other team research services and experts to expand the precision medical ecosystem.In order to integrate with Azure cloud computing, massive amounts of data are processed for gene detection using AI, which drastically reduces data comparison time and gene testing costs. It also assist medical specialists in the rapid prediction of potential diseases. As for the resources to establish TaiGenomics, they will all be placed in cloud storage in order to solve the problem of massive data needed for genetic testing.

Key word：

Microsoft

Release time：2019-01-03 00:00 reading：1042 Continue reading>>

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BMW, Microsoft Join $200 Million Graphcore Funding

UK-based developer of machine intelligence processors Graphcore announced a new round of $200 million in funding, including investment from BMW and Microsoft. The deal — which brings Graphcore's total funding to $300 million — values the company at $1.7 billion.The intensive computation requirements of the autonomous vehicle market make an ideal fit for Graphcore. With automakers launching cloud connected services, the demand for processing power and intelligence will grow, and manufacturers will no doubt be looking for efficiencies from the hardware platforms in the car as well as the cloud.Nigel Toon, CEO and co-founder of Graphcore, told EETimes that the company currently employs 200 people, and the funding will enable it to scale up to double that size in 2019, and double again by the end of 2020.“Machine intelligence marks the start of a new age of computing which needs a radically different type of processor and software tools," Toon said. "This new, fast growing market creates the opportunity for Graphcore to build a major global technology company that can help innovators in AI achieve important breakthroughs.”Graphcore said it has already started shipping first products to early access customers and generated first revenues this year, just two years after the company was founded. It also claimed high volume production is now ramping up to meet customer demand for its IPU PCIe processor cards. Graphcore said its IPU is designed specifically for machine intelligence training and inference and delivers an increase in speed of 10x to 100x compared to today’s hardware.This latest round of funding will enable Graphcore to execute on its product roadmap, accelerate production and expand the company’s global footprint. It will also hire new engineers at its headquarters in Bristol, UK, and at its other offices in London, Oslo, Silicon Valley, and at new offices it is planning to open in Beijing and Taiwan.We asked Toon whether the next step for the company will be an IPO to enable an exit for some of the early investors, but he did not want comment on the timeline for this, recognizing that investors would be looking for an exit, but also emphasizing that the company is still in its growth phase and there is still work to do to scale up.The AI chip market has seen a huge amount of activity this year, with a number of companies seemingly picking up momentum, including Cerebras, Graphcore, Wave Computing, Horizon Robotics, Cambricon Technologies and DeePhi. According to Woodside Capital Partners, the AI chipset market is expected to grow to$43.3 billion in 2023 from $6.8 billion in 2017.In the last few weeks, it is reported that Chinese company Horizon Robotics raised up to $1 billion, valuing the company at up to $4 billion. Earlier this year, Cambricon Technologies (also Chinese) was valued at $2.5 billion.Woodside says AI semiconductors are entering an inflexion point – semiconductors based on Moore’s Law have been pushed to the limit, and expansion of data is much faster than the data processing capabilities of the chip, even if process technology is getting down to 7nm nodes.According to Woodside, Darpa is driving a "third wave" of AI that emphasises self-learning AI, involving contextual adaptation and characterizing the real world, and generating contextual models to drive decisions. Topping the $300 million funding mark is a significant achievement for a European semiconductor startup, making Graphcore a true European semiconductor "unicorn" at a time when most of the large VC deals in Europe tend to go to software and internet companies.We spoke to one of the veterans of the European tech investor ecosystem, Jean-Michel Deligny, a senior advisor to Silverpeak, a technology investment bank, and personally involved in transactions like the most recent funding rounds for UltraSoC and Kalray. Deligny said this is a fantastic outcome for a European company, adding that of the 53 AI startups listed in Woodside Capital’s recent report, only eight are based in Europe. He also pointed out that the wave of financing deep learning and hardware accelerators is an investment bubble, and the new frontier to watch is the third generation of AI, with neuromorphic AI companies, such as Vicarious in the U.S., or AnotherBrain in Europe.Deligny said that while Europe lost the battle in big data to the U.S. and China, it is intent on playing a key role in developing the next frontier in AI — the tech hardware independent of big data. “While deep learning involves categorization, the next wave of AI will explain this information to the world, which is where self-learning AI will come in,” he said.Graphcore's latest funding round was led by existing investor Atomico and new investor Sofina. Merian Global Investors. In addition to BMW i Ventures and Microsoft, funding was provided by follow on investments from existing investors including: Amadeus Capital Partners, Atomico, Robert Bosch Venture Capital, C4 Ventures, Dell Technologies Capital, Draper Esprit, Foundation Capital, Pitango and Sequoia Capital

Key word：

BMW, Microsoft

Release time：2018-12-26 00:00 reading：1027 Continue reading>>

Citrix partners <span style='color:red'>Microsoft</span> to simplify office network deployments

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Citrix partners Microsoft to simplify office network deployments

Desktop virtualisation company on Friday announced a partnership with Microsoft to deliver consistent productivity and automate the branch-office network deployments.Citrix will provide its "SD-WAN" solution as the on-ramp to Microsoft Azure for the new Azure Virtual WAN service. The joint solution is designed to help enhance user experience and deliver better productivity."These joint solutions give customers a much richer experience, granular levels of security at an app level and more choice and flexibility as they move ahead in their cloud journey," said Makarand Joshi, Area Vice President and Country Head, India Subcontinent, Citrix.While Azure Virtual WAN can be procured in a way familiar to most Public Cloud users, Citrix "SD-WAN" can be purchased directly from Citrix channel partners or from the Azure Marketplace."We are collaborating on new Citrix SD-WAN solution on Azure which will bring new and exciting functionality for our mutual customers," said Ross Ortega, Partner PM Manager, Microsoft Azure.

Key word：

Microsoft

Release time：2018-07-16 00:00 reading：1000 Continue reading>>

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Microsoft, MediaTek Team on IoT SoC

　　MediaTek is working with Microsoft to deliver this year the first Azure Sphere chip, the MT3620 that the partners expect to drive IoT innovation with built-in security and connectivity.　　Azure Sphere is designed for highly secured, connected MCU-powered devices at a price that the companies expect will make enterprise-class security affordable for an array of cloud-connected gadgets.　　MediaTek and Microsoft have worked together to develop a specialized chipset with a Wi-Fi connected controller built around a processor designed to run Azure Sphere’s IoT operating system that includes support for Microsoft’s latest security protocols. The chipsets will be sold as part of the Azure Sphere solution, enabling customers to connect their MCU-powered products and devices with protection and security provided by Microsoft.　　"Microsoft had a vision we also believed in. Bringing trust and security into IoT solutions from chip to cloud, to make connected devices practical to sell and manage for businesses and consumers," said Jerry Yu, a MediaTek vice president, in a press statement.　　MediaTek is the reference chip partner for the Azure Sphere Partner Program.　　Cost and Security　　The partners expect a significant drop in the cost of connectivity will allow billions of MCU-powered devices, from household appliances and health monitors to children’s toys and industrial equipment to become IoT devices.　　Yet each connection is vulnerable to attacks. IoT won’t become a mass market until devices, data and cloud are secure. That’s the fundamental problem the two companies aim to solve with their latest project.　　With more than 9 billion microcontroller-powered devices entering the market annually, Microsoft and MediaTek see as critical the need to ensure every connected device, regardless of price point, has the highest level of security embedded.　　"In the next decade we’ll see the democratization of connectivity to billions of devices,” said Microsoft Managing Director Galen Hunt. "Azure Sphere brings together the best of Microsoft’s expertise in cloud, software, and silicon - resulting in a unique approach to security that starts in the silicon and extends to the cloud."　　The MediaTek MT3620 is the first Azure Sphere-certified chip, which the companies expect will be the foundation for a new generation of secure intelligent edge devices and solutions.　　With Azure Sphere, Microsoft aims to build a new ecosystem, consisting of silicon vendors, ODMs and OEMs from a broad range of industries.　　Recognizing the opportunities and risks associated with the growing number of IoT devices and applications, a group of companies have banded together to ensure that security standards are developed and upheld, according to Microsoft.　　MediaTek is now sampling chips with lead customers and expects to ramp production by the third quarter of 2018.

Key word：

Microsoft, MediaTek,IoT

Release time：2018-04-18 00:00 reading：996 Continue reading>>

<span style='color:red'>Microsoft</span> to make $5bn investment into IoT

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Microsoft to make $5bn investment into IoT

　　Microsoft has announced it will invest $5 billion in the IoT over the next 4 years in an effort to ‘give every customer the ability to transform their businesses, and the world at large, with connected solutions’.　　The company claims that it’s been investing in IoT before the term was even coined, and is now planning to dedicate ‘even more’ resources to research and innovation in IoT, which it says is ‘evolving to be the new intelligent edge’.　　According to Microsoft, it’s seeing the increased adoption and exponential growth that analysts have been forecasting for years, and apparently, it’s ‘only just getting started’.　　A.T. Kearney predicts IoT will lead to a $1.9 trillion productivity increase and $177 billion in reduced costs by 2020. Microsoft believes this effect will be pervasive, from connected homes and cars, to manufacturers, smart cities and utilities—and everything in between.　　This increased investment will support continued innovation in its technology platform, Microsoft adds, and the company intends to continue research and development in key areas. This includes securing IoT, creating development tools and intelligent services for IoT and the edge, and investments to grow its partner ecosystem.　　Microsoft says that companies such as Steelcase, Kohler, Chevron, United Technologies and Johnson Controls are all already innovating with its IoT platform, launching products, solutions and services that ‘transform’ their business.　　With each of these new implementations, Microsoft says that it’s witnessing a ‘unique transformation’, along with gaining insight into how both customers and partners overcome the specific challenges of building an IoT solution that harnesses massive amounts of data.　　Although Microsoft is looking to spend $5 billion, it hasn’t given specifics on this spend, which is understandable. The company appears to be waiting to see what will happen in the next 4 years with this intelligent edge and what will be a worthwhile investment.

Key word：

Microsoft,IoT

Release time：2018-04-09 00:00 reading：898 Continue reading>>

<span style='color:red'>Microsoft</span> Says CPU Security Fixes Slow Computers

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Microsoft Says CPU Security Fixes Slow Computers

　　Patches issued by Microsoft to safeguard against the Spectre and Meltdown vulnerabilities uncovered by researchers have a noticeable impact on PC performance in systems with older Intel processors, Microsoft said Tuesday (Jan. 9).　　Patches issued to mitigate Meltdown and one variant of Spectre have minimal performance impact, Microsoft said in a posting on its website. However, mitigations for Spectre variant 2 to carry a performance impact that will be noticeable on systems from 2015 or earlier running Windows 10, Windows 8 or Windows 7, the company said.　　PCs with running Windows 10 with newer Intel processors — Skylake, Kabylake or newer — will experience performance decreases so slight — measured in microseconds — that most users are unlikely to notice, Microsoft said.　　Intel has largely sought to downplay the performance impact of the fixes since the newly discovered vulnerabilities were disclosed by researchers last week. While some have reported that the fixes may hurt by performance by as much as 30 percent on systems with older Intel chips, Intel has stressed that the impact is highly workload dependent.　　During his keynote address at the Consumer Electronics Show in Las Vegas Monday, Intel President and CEO Brian Krzanich said Intel expects to issue updates for 90 percent of its products released in the last five years within the next week, with the remainder due to be issued before the end of January.　　"We believe the performance impact of these updates is highly workload dependent," Krzanich said. "As a result, we expect some workloads may have a larger impact than others, so we will continue working with the industry to minimize the impact on those workloads over time."　　Microsoft said it has made available mitigation patches for 41 of the 45 versions of Windows that it sells. A blog posting on Microsoft's website by Terry Myerson, executive vice president of the Windows and Devices group, said the company expects the remaining patches to be issued soon.　　While Intel processors are seen as most directly at risk from the vulnerabilities, ARM-based processors and processors from AMD are also impacted.　　The vulnerabilities, discovered by researchers from Google Project Zero and others, point to how hackers could use software analysis techniques to exploit speculative execution in modern processors to perform side-channel attacks. There have been no known attacks exploiting these vulnerabilities.

Key word：

Microsoft,CPU

Release time：2018-01-11 00:00 reading：1231 Continue reading>>

<span style='color:red'>Microsoft</span> Describes Next Xbox SoC

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Microsoft Describes Next Xbox SoC

　　Microsoft described Scorpio, the SoC inside its Xbox X One. The device, detailed at Hot Chips, aims to balance cost and performance for 4K gaming in a console shipping in November.　　Scorpio packs 7 billion transistors with 6 TFlops graphics performance in a 359 mm2 chip made in a 16FF+ TSMC process. The chip, designed in partnership with AMD, also packs eight x86 cores running at 2.3 GHz and sharing 4 Mbytes L2 cache.　　Scorpio uses 12 GBytes of GDDR5 memory rather than 32 MBytes embedded SRAM used in a prior generation or a high-bandwidth memory (HBM) module which engineers considered. “We were a little nervous making a consumer product with data moving around at 6.8 GHz,” said John Sell, a Microsoft distinguished engineer, referring to the GDDR5 data rate.　　The single large block of memory enables much simpler tools for application developers, Sell said. It also emulates the embedded SRAM for compatibility with apps written for the prior console.　　Microsoft kicked the tires of the kinds of HBM modules AMD pioneered in GPUs in 2015 and Nvidia uses now on Volta. “But for a consumer product HBM2 is too expensive and inflexible…its memory bandwidth is not as granular, and we would be locked into [an HBM] module,” Sell said.　　It’s too early to tell what the next generation trade-offs will look like, but both a Jedec GDDR6 and an HBM3 are in the works. A major cost issue for HBM is a lack of test coverage and thus relatively low yields, he said.　　Other memory alternatives may include modules using lower cost organic substrates than the silicon interposer in HBM. Intel has its own alternative called EMIB for its foundry customers. However, Microsoft aimed to reuse many blocks, particularly some custom analog designs from the existing Xbox One S that also was made in a TSMC 16FF+ process.　　The 16FF+ process “is quite mature now — we actually used it for the Xbox One S — but this is still one of TSMC’s largest 16FF+ chips,” he said.　　The majority of Scorpio consists of 40 graphics processing units, four spares and shader arrays running at a core frequency of 1.172 GHz.　　AMD’s Zen x86 core was not ready in time for the SoC which uses eight older AMD CPUs. However, they are newer and faster units than on the closest rival console, Sell said.　　The SoC supports HEVC encode and decode at 60 Hz. It also includes eight custom audio processors enhanced for spatial audio. A separate south bridge includes I/O for PCIe, USB and a SATA hard disk. The entire system will sell for about $500, including an integrated Blu-ray drive.

Key word：

Microsoft,Xbox SoC

Release time：2017-08-23 00:00 reading：1100 Continue reading>>

Rambus, <span style='color:red'>Microsoft</span> Heat Up With Cold DRAM

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Rambus, Microsoft Heat Up With Cold DRAM

　　A community of computer scientists striving to respond to soaring system demand for real-time data processing has just received some good news.　　Rambus revealed Monday (April 17) that the company, in collaboration with Microsoft researchers, will have an early prototype of cryogenic memory in a month, and a more complete one by the end of the year. The new technologies will be essential to data centers, “currently the fastest growing consumer of memory” in the industry, Craig Hampel, chief scientist at Rambus, told EE Times.　　The new memory subsystems will be able to operate below minus?180 °C or minus?292.00 °F or 93.15 kelvin. This will substantially reduce energy consumption and improve the overall performance of a bank of computers deployed in the cloud for massive data processing, he explained.　　Rambus and Microsoft struck a deal in late December, 2015 to pool resources and develop memory systems for next-generation quantum computing.　　Rambus’ announcement on Monday is the first tangible result of the joint efforts. Such cryogenic techniques mark a significant change in DRAM operating temperatures.　　However, during the initial partnership announcement, the two companies did not mention the development of cryogenic DRAM. Instead, they appeared more interested in developing memory systems for next-generation quantum computing. So, how does their latest announcement relate to that?　　Hampel explained that this all fits into a greater strategy to advance systems to superconducting computing and ultimately to quantum computing. Rambus explained that by breaking down the cryogenic systems’ long-term goal for quantum computing in bite size, they have applied the new technologies to prototyping DRAM that can operate below 90 kelvin.　　The U.S. National Institute of Standards and Technology has chosen to consider the field of cryogenics as that involving temperatures below minus?180 °C or minus?292.00 °F or 93.15 kelvin (K).　　Conventional DRAM operates at room temperature – roughly at 350 and 350 K. By cooling down to 90 K, “you bring down the leakage to zero, while achieving higher performance at a much lower temperature,” explained Hampel.　　Once you bring the temperature down to 7 K, that’s when you get into the superconducting domain, he added. “It allows all of the interconnect power to become zero.”　　To get to quantum computing, however, cryogenic memory must “operate at 20 to 40 millikelvin, which is essentially colder than deep space,” said Hampel.　　Thus far, by succeeding in a DRAM prototype that works at colder than 90 K, Rambus is “hopeful,” said Hampel, that this leads to “better DRAM scaling, lowering cost and increasing reliability” in subsystems currently under tremendous thermal stress.　　The goal is a cryogenic memory subsystem in the next two to three years, according to Hampel.　　To get there, the Rambus-Microsoft partnership is still missing a third leg: DRAM and foundry suppliers. Rambus isn’t announcing that today but will soon need to address it.　　In search of new memory architecture　　Looking back on Rambus’ history, Hampel said, “We have always pushed the new memory architecture” in new markets. In the late ’80s to early ’90s, Rambus went after the PC market with its proprietary memory technologies, and ended up entangled in a standards war. Then, by mid-1990s, Rambus shifted focus to the video game console market, getting its RDRAM adopted by Nitendo 64 and Sony’s PlayStation.　　As the growth of PCs and game consoles have slowed and smartphones are getting fragmented, Hampel said, “We approached Microsoft for partnership,” as both companies identified data centers as “the best home for new memory innovation.”

Key word：

Rambus

Release time：2017-04-17 00:00 reading：881 Continue reading>>

model	brand	Quote
RB751G-40T2R	ROHM Semiconductor
MC33074DR2G	onsemi
CDZVT2R20B	ROHM Semiconductor
BD71847AMWV-E2	ROHM Semiconductor
TL431ACLPR	Texas Instruments

model	brand	To snap up
STM32F429IGT6	STMicroelectronics
BU33JA2MNVX-CTL	ROHM Semiconductor
BP3621	ROHM Semiconductor
TPS63050YFFR	Texas Instruments
ESR03EZPJ151	ROHM Semiconductor
IPZ40N04S5L4R8ATMA1	Infineon Technologies

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